Fabrication of capacitive micromachined ultrasonic transducers with through-glass-via interconnects

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dc.contributor.authorZhang, Xiao
dc.contributor.authorYamanery, F. Yalçın
dc.contributor.authorOralkan, Ömer
dc.date.accessioned10.07.201910:49:13
dc.date.accessioned2019-07-10T19:37:55Z
dc.date.available10.07.201910:49:14
dc.date.available2019-07-10T19:37:55Z
dc.date.issued2015
dc.departmentİstanbul Medipol Üniversitesi, Mühendislik ve Doğa Bilimleri Fakültesi, Elektrik ve Elektronik Mühendisliği Bölümü
dc.description.abstractThis paper introduces a novel fabrication method for capacitive micromachined ultrasonic transducer (CMUT) arrays amenable to 3D integration. The work demonstrates that MEMS structures can be directly built on a through-glass-via (TGV) substrate. The key feature of this new approach is the combination of TGV interconnects with a vibrating silicon-plate structure formed by anodic bonding. This method simplifies the overall fabrication process for CMUTs with through-wafer interconnects by eliminating the need for an insulating lining for vias or isolation trenches. Fabrication of CMUTs on a glass substrate and use of copper-filled vias as interconnects can help reduce the parasitic interconnect capacitance and resistance, improving device performance and reliability. This work is especially important for fabricating 2D CMUT arrays and integrating them closely with supporting electronic circuits.
dc.identifier.citationZhang, X., Yamanery, F. Y. ve Oralkan, Ö. (2015). Fabrication of capacitive micromachined ultrasonic transducers with through-glass-via interconnects. IEEE International Ultrasonics Symposium (IUS). Taipei, Taiwan, Octomber, 21-24, 2015. https://dx.doi.org/10.1109/ULTSYM.2015.0060
dc.identifier.doi10.1109/ULTSYM.2015.0060
dc.identifier.isbn9781479981823
dc.identifier.scopusqualityN/A
dc.identifier.urihttps://hdl.handle.net/20.500.12511/1500
dc.identifier.urihttps://dx.doi.org/10.1109/ULTSYM.2015.0060
dc.identifier.wosqualityN/A
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherInstitute of Electrical and Electronics Engineers
dc.relation.ispartofIEEE International Ultrasonics Symposium (IUS)en_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/embargoedAccess
dc.subject3D Integration
dc.subjectAnodic Bonding
dc.subjectCMUT
dc.subjectGlass
dc.subjectTGV
dc.titleFabrication of capacitive micromachined ultrasonic transducers with through-glass-via interconnects
dc.typeConference Object

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