Design of high-frequency broadband CMUT arrays

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dc.contributor.authorZhang, Xiao
dc.contributor.authorYamanery, Feysel Yalçın
dc.contributor.authorAdelegan, Oluwafemi Joel
dc.contributor.authorOralkan, Ömer
dc.date.accessioned10.07.201910:49:13
dc.date.accessioned2019-07-10T19:37:56Z
dc.date.available10.07.201910:49:14
dc.date.available2019-07-10T19:37:56Z
dc.date.issued2015
dc.departmentİstanbul Medipol Üniversitesi, Mühendislik ve Doğa Bilimleri Fakültesi, Elektrik ve Elektronik Mühendisliği Bölümü
dc.description.abstractIn this work we demonstrate a high-frequency (29-MHz) broadband (100% FBW) CMUT 1D array. The devices are fabricated using anodic bonding with only three photolithography steps. We also discuss the design guidelines for high-frequency broadband CMUTs using the simulations. A high fill factor and a thin plate are important for the broadband design. Small cell size is required for the increased center frequency. To improve the transducer sensitivity and to keep the collapse voltage low, the gap height should be small and a high-k dielectric insulation layer should be employed. The fabrication steps we report in this paper have good potential to meet the high-frequency broadband CMUT design requirements. So far we have demonstrated that we can define a 50-nm gap, bond to a post as narrow as 2 µm, and pattern a high-k dielectric layer on the bottom electrode. © 2015 IEEE.
dc.description.sponsorshipNorth Carolina State University Defense Advanced Research Projects Agency: D13AP00043 National Institutes of Health: EB018512 North Carolina State Universityen_US
dc.identifier.citationZhang, X., Yamanery, F. Y., Adelegan, O. J. ve Oralkan, Ö. (2015). Design of high-frequency broadband CMUT arrays. IEEE International Ultrasonics Symposium (IUS), Taipei, Taiwan, October, 21-24, 2015. https://dx.doi.org/10.1109/ULTSYM.2015.0167
dc.identifier.doi10.1109/ULTSYM.2015.0167
dc.identifier.isbn9781479981823
dc.identifier.scopusqualityN/A
dc.identifier.urihttps://hdl.handle.net/20.500.12511/1501
dc.identifier.urihttps://dx.doi.org/10.1109/ULTSYM.2015.0167
dc.identifier.wosqualityN/A
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherInstitute of Electrical and Electronics Engineers
dc.relation.ispartofIEEE International Ultrasonics Symposium (IUS)en_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/embargoedAccess
dc.subjectAnodic Bonding
dc.subjectBroadband
dc.subjectCMUT
dc.subjectGlass
dc.subjectHigh Frequency Transducer Array
dc.subjectArray
dc.subjectBroadband
dc.subjectCMUT
dc.titleDesign of high-frequency broadband CMUT arrays
dc.typeConference Object

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