Konu "3D Integration" için Electrical and Electronics Engineering listeleme
Toplam kayıt 2, listelenen: 1-2
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Fabrication of capacitive micromachined ultrasonic transducers with through-glass-via interconnects
(Institute of Electrical and Electronics Engineers, 2015)This paper introduces a novel fabrication method for capacitive micromachined ultrasonic transducer (CMUT) arrays amenable to 3D integration. The work demonstrates that MEMS structures can be directly built on a through-glass-via ... -
Fabrication of vacuum-sealed capacitive micromachined ultrasonic transducers with through-glass-via interconnects using anodic bonding
(IEEE, 2017)This paper presents a novel fabrication method for vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays that are amenable to 3D integration. This paper demonstrates that MEMS structures can be directly ...