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dc.contributor.authorZhang, Xiao
dc.contributor.authorYamaner, Feysel Yalçın
dc.contributor.authorOralkan, Ömer
dc.date.accessioned10.07.201910:49:13
dc.date.accessioned2019-07-10T19:58:38Z
dc.date.available10.07.201910:49:13
dc.date.available2019-07-10T19:58:38Z
dc.date.issued2017en_US
dc.identifier.citationZhang, X., Yamaner, F. Y. ve Oralkan, Ö. (2017). Fabrication of vacuum-sealed capacitive micromachined ultrasonic transducers with through-glass-via interconnects using anodic bonding. Journal of Microelectromechanical Systems, 26(1), 226-234. https://dx.doi.org/10.1109/JMEMS.2016.2630851en_US
dc.identifier.issn1057-7157
dc.identifier.issn1941-0158
dc.identifier.urihttps://dx.doi.org/10.1109/JMEMS.2016.2630851
dc.identifier.urihttps://hdl.handle.net/20.500.12511/3203
dc.descriptionWOS: 000397049500023en_US
dc.description.abstractThis paper presents a novel fabrication method for vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays that are amenable to 3D integration. This paper demonstrates that MEMS structures can be directly built on a glass substrate with preformed through-glass-via (TGV) interconnects. The key feature of this new approach is the combination of copper through-glass interconnects with a vibrating silicon-plate structure suspended over a vacuum-sealed cavity by using anodic bonding. This method simplifies the overall fabrication process for CMUTs with through-wafer interconnects by eliminating the need for an insulating lining for vias or isolation trenches that are often employed for implementing through-wafer interconnects in silicon. Anodic bonding is a low-temperature bonding technique that tolerates high surface roughness. Fabrication of CMUTs on a glass substrate and use of copper-filled vias as interconnects reduce the parasitic interconnect capacitance and resistance, and improve device performance and reliability. A 16x16-element 2D CMUT array has been successfully fabricated. The fabricated device performs as the finite-element and equivalent circuit models predict. A TGV interconnect shows a 2-Omega parasitic resistance and a 20-fF shunt parasitic capacitance for 250-mu m via pitch. A critical achievement presented in this paper is the sealing of the CMUT cavities in vacuum using a PECVD silicon nitride layer. By mechanically isolating the via structure from the active cells, vacuum sealing can be ensured even when hermetic sealing of the via is compromised. Vacuum sealing is confirmed by measuring the deflection of the edge-clamped thin plate of a CMUT cell under atmospheric pressure. The resonance frequency of an 8-cell 2D array element with 78-mu m diameter circular cells and a 1.5-mu m plate thickness is measured as 3.32 MHz at 15-V dc voltage (80% Vpull-in).en_US
dc.description.sponsorshipNational Science Foundation, National Nanotechnology Coordinated Infrastructure (NNCI) [ECCS-1542015]; State of North Carolina; National Science Foundation [ECCS-1542015]en_US
dc.description.sponsorshipThe authors would like to thank Tim Mobley and John Maki from Triton Microtechnologies for helping with the fabrication of TGV substrates. The device fabrication was performed in part at the NCSU Nanofabrication Facility (NNF), a member of the North Carolina Research Triangle Nanotechnology Network (RTNN), which is supported by the National Science Foundation (Grant ECCS-1542015) as part of the National Nanotechnology Coordinated Infrastructure (NNCI). The device characterization was performed in part at the Analytical Instrumentation Facility (AIF) at North Carolina State University, which is supported by the State of North Carolina and the National Science Foundation (award number ECCS-1542015). The AIF is a member of the North Carolina Research Triangle Nanotechnology Network (RTNN), a site in the National Nanotechnology Coordinated Infrastructure (NNCI).en_US
dc.language.isoengen_US
dc.publisherIEEEen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectCapacitive Micromachined Ultrasonic Transducer (CMUT)en_US
dc.subjectThrough-Glass-Via (TGV)en_US
dc.subjectAnodic Bondingen_US
dc.subject3D Integrationen_US
dc.subjectGlassen_US
dc.titleFabrication of vacuum-sealed capacitive micromachined ultrasonic transducers with through-glass-via interconnects using anodic bondingen_US
dc.typearticleen_US
dc.relation.journalJournal of Microelectromechanical Systemsen_US
dc.departmentİstanbul Medipol Üniversitesi, Mühendislik ve Doğa Bilimleri Fakültesi, Elektrik ve Elektronik Mühendisliği Bölümüen_US
dc.authorid0000-0003-3841-2943en_US
dc.identifier.volume26en_US
dc.identifier.issue1en_US
dc.identifier.startpage226en_US
dc.identifier.endpage234en_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.identifier.doi10.1109/JMEMS.2016.2630851en_US


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