Bond strength of resin composite to light activated bleached enamel
Göster/ Aç
Erişim
info:eu-repo/semantics/openAccessAttribution-NonCommercial-ShareAlike 3.0 Unportedhttps://creativecommons.org/licenses/by-nc-sa/3.0/Tarih
2016Üst veri
Tüm öğe kaydını gösterKünye
Yavuz, T., Özyılmaz, Ö. Y., Öztürk, A. N. ve Aykent, F. (2016). Bond strength of resin composite to light activated bleached enamel. Nigerian Journal of Clinical Practice, 19(6), 766-771. https://dx.doi.org/10.4103/1119-3077.178909Özet
Objectives: This study evaluated the microtensile bond strength (mu TBS) of a resin composite bonded to bleached enamel as a function of bleaching conditions. Materials and Methods: The whiteness hydrogen peroxide (HP) bleaching agent containing 35% HP was applied to the central incisors' facial enamel surface and irradiated as follows: No treatment (G1; control); no light (G2); light-emitting diode, the 40s (G3); diode laser, the 20s (G4); and neodymium: yttrium aluminum garnet laser, 20s (G5). A Variolink II resin composite structure was then built up incrementally on the surface. The teeth were sectioned into three 1.2 mm x 1.2 mm wide "I"-shaped sections. The specimens were then subjected to microtensile testing at a crosshead speed of 1 mm/min. Data were analyzed using one-way ANOVA (alpha = 0.05) followed by the Tukey Honestly Significant Difference post-hoc test. The fractured surfaces were observed with a stereomicroscope at x 100 magnification. Results: One-way ANOVA revealed no statistical differences among the groups (P > 0.05). No differences appeared between the groups bonded 14 days after bleaching (P > 0.05). Mean mu TBS values (MPa) were as follows: 22.05 +/- 5.01 (G1); 19.6 +/- 5.6 (G2); 19.3 +/- 5.4 (G3); 20.08 +/- 2.08 (G4); and 18.1 +/- 4.8 (G5). Many adhesive failures occurred at the bleached and irradiated enamel surfaces. Conclusion: The various irradiation treatments following the application of the whiteness HP bleaching agent to enamel did not significantly reduce the mu TBS within a 14-day period.