Yayıncı "IEEE" Makale Koleksiyonu için listeleme
Toplam kayıt 2, listelenen: 1-2
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Fabrication of vacuum-sealed capacitive micromachined ultrasonic transducers with through-glass-via interconnects using anodic bonding
(IEEE, 2017)This paper presents a novel fabrication method for vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays that are amenable to 3D integration. This paper demonstrates that MEMS structures can be directly ... -
Guard band reduction for 5G and beyond multiple numerologies
(IEEE, 2020)The existence of inter-numerology interference (INI) is a major drawback for the flexible multi-numerology frame structure proposed for the upcoming fifth generation New Radio (5G-NR). Insertion of a guard band (GB) between ...